ZD8000 thermal Pads

Similar Questions

• Thermal Pad thickness, brand and Type of GPU memory (surrounds the GPU chip) iMac late 2009?

  Hello. I'll be repair (and cleaning after 6 years) 2009 end iMac coz ' the screen has five 2cm thick, uniformly distributed, striped of vertical lines (it is still usable in Mode safe), which indicates a good chip GPU (used to pass all the tests of stress for the GPU and GPU memory) but a subcomponent that surrounds it has weld fracture joint coz' it may have overheated in the summer (which has a record high 36 to 42 degrees Celsius) and OS X might not revved up fans enough that may have contributed to cause solder joint breaking.

  When I open the iMac Monday, the thermal pads for memories of the GPU (surrounds the GPU chip I use a thermal paste with) may not be in good condition more. I was wondering how thick cushion is suitable for the GPU of the iMac (an ATI Radeon HD 4850 512 MB), what brand and what type (if the thickness is perhaps the most important)?

  Thank you. God bless you. Revelation 21:4

  I would like to contact https://www.ifixit.com/

  If anyone should know...

• 1245dx D7 - reapply the thermal grease for CPU/GPU - GPU thermal pad

  The result is a hp pavilion dv7 1245dx having heating issues so disassabled to clean it and apply new thermal grease and notice that the video chip has a thermal pad instead of thermal grease. This is what it looks like.

  Guys/girls do you think it is reusable or do I need to replace it as well. If I need to replace it, what are my options? Difficult to find a pad thermal repalcement anywhere. A decent high CoolerMaster performace size heat for the CPU it's okay.

  Yes, it uses a thermal buffer, because the gap is too big to fill with dough. You can reuse the pad. Some people even make a solid metal shim in sheet copper or a hammered out penny and you can apply heat is dedicated to that.

• Thermal pad for custom game

  Hi all

  I am trying to create a thermal pad for the OPA561. According to the manual on this pad dimensions SMT IC must be created. In addition, thermal vias should be placed on the SMT pad with diameter of 13 mils. When to place the pad SMT dialog box appears to select the rolling for the via; However, it is not a layer to select it, as the dialog box is empty. When I press 'OK', the path is placed on the pad, but I can't. I know that the path is there, because I can select, but it is invisible. I tried selecting high copper or the low levels, but to no avail. Does anyone have suggestions as to how to solve this problem.

  Thank you.

  Regads,

  Viktar

  Hi Viktar,

  You try to place a via the component edit mode? The best way to place the via would be on the Board of Directors itself after the part has been placed. If you attempt to add a via at the level of the component (ie. in component edit mode), will not be aware of the number of layers on your particular board - so why stratification does not appear I guess.

  After you have created the custom for your part cushion, place the part in your design. Then place the via - you should see slats (as shown below).

  If you still have questions, it might help to post an example of your file so that we can solve it.

  Natasha

  

• New thermal pads are needed?

  Hi, I have a HP Pavilion DV4T-1400, with a bad card system.

  I'm putting the new motherboard and I must of course reconnect the heat sync.

  I have a thermal paste for the proc/heatsync but there are a few thermal pads on the Northbridge Clip that are always connected.

  How is it important that I replace the thermal pads?

  I replaced the thermal paste anyway.

  Thanks for your help, I apologize for my n00bness.

  Hello:

  It's hard to say. By the book, they should be replaced. But if they always seem good and you don't lose the thermal material then you can probably use again them.

  You should never attempt to fill the gaps in the thermal paste, but it's up to you (I did previously on pads thermal office and never had a problem).

  Just make sure that you use good quality thermal paste and apply it sparingly. You want just a thin layer between these surfaces.

  Worst case scenario is that if you find your fan running higher than expected, you need to go back to the drawing board.

  Paul

• Question about the thermal pads

  Hello, I have a question, is what heat pad should I use heat pads HP service guide for my graphics chip, this is what it says and how do I use them

  "The thermal pads are used on the Northbridge contact (3) and chip Northbridge (4), chart/heat sink contact (5) and chip subsystem (6) graph and chart/heat sink contact (7) and capacitors (8).

  http://h10032.www1.HP.com/CTG/manual/c02666747.PDF

  The question is, what thermal pad use? Because I have a 0, 5mm thick, another of 1 mm and another 2 mm, and I don't know which one I need

  Look at the picture on page 96 of the Manual:

  Manual

  Each chip that needs a thermal buffer is a different size and shape. Are the keys that you have replacements or you reuse the original? They are different sizes and shapes, apart from the thickness? Otherwise, I would bolt the heater without heat is dedicated to the as a dry and watch the free space on each chip. It should be obvious which cooling pads on the heat sink are closest chips on the motherboard and organize them accordingly. The pads should be compressed a little when screw you the radiator.

  If it's 'the Answer' please click on 'Accept as Solution' to help others find it.

• Pavilion dv7t 6100 - LM726AV: replacement of heat-sink/fan using the thermal pads and thermal paste/paste

  Hello

  The fan on my laptop died so I am trying to replace the fan and the heatsink unit. The manual that I use specifies that thermal grease should be used on the cpu and heat pads must be used on the graphics processor and the capacitors.

  The arrival of the new fan it came with heat pads on all relevant areas of the sink as a tube of thermal grease. When I removed the old fan, thermal pads have proved only on the capacitors and the components around the GPU and that thermal grease was used on the CPU and the GPU.

  My question is: how this part must be installed? Should I remove the fron pads thermal heat sink that covers the processor cpu and graphics and do not use the thermal grease in these areas? Or the thermal grease can be used here and let the thermal pads on the heat sink?

  Thanks for your help - thank you for the advice/opinions in this case.

  You can remove the protections and pass with the dough so but only f, you are sure that the metal on the core processor and graphic is in solid contact. And there, I meant it touches and also has a lower compression. For me, the thermal paste is superior coolant and should be used on really hot spots. However, if the metal is not full, solid contact you run the risk of overheating.

  If it's 'the Answer' please click on 'Accept as Solution' to help others find it.

• Thermal paste or thermal Pad?

  Hi I have a M17x which came with two Nvidia Geforce GTX 280 m SLI graphics cards, as I can switch between hybrid and discrete graphics modes I believe is the saying,

  It also has the third on board graphic chip Nvidia Geforce 9400, which is where my question in fact because this chip shares the same radiator as well cpu I upgraded the processor is a few days and doing so re thermaled the cpu but the Geforce 9400 looked like originally, he was given a bottle and not glued?

  So I left as is and re - apply the heatsink on the cpu and 9400 each chip has 4 screws around the cpu & gpu lock and hope for the best.

  But since I kept an eye on the time and the Nvidia Geforce 9400 that i never, I always use SLI with the 280 has seen some time whereas this is not used and every other chip is always at least 20 degrees colder I saw between 60 81 deg while everything else is way lower so that I have to buy thermal pads and use a sub it or can I use the same dough I used on my cpu because it must be the problem, Yes?

  Hello

  We recommend that you use a heat mat or use the same dough, either option should help to lower temperatures. Temperatures are high for this type of video card, especially if you don't use it yet.

• Pad thermal thickness

  Hello

  Small question, I have a T61 14 in. and I wanted to know what thickness of the thermal pad comes into contact with the southbridge chip must be?

  I tried searching this site and Google for this type of information, and it came with no result, because I noticed the variety of thickness there when I tried to buy a.

  Thank you.

  I've never seen that number anywhere. When I replace the pads, I use 1.5 mm

• HP Pavilion dv7 model 7135us: pad thermal CPU fan

  I am buying a new thermal pad, but there is so much. I'm trying to get a picture of the fan on the site of HP parts store but am UN able to do. Does anyone have a photo of the CPU for a HP Pavillion dv7 fan model # 7135us. The part # is 682100-001. Janelle thanks

  Hi @Nell4 ,

  Thank you for visiting the HP Forums! A place where you can find solutions for your problems with the help of the community!

  I stumbled upon your post on the laptop and wanted to help you! I looked in your question about your HP Pavilion dv7-7135us Notebook and needing help with the parts of the fan Assembly. Here is a link that should help to show you the parts.

  I hope this helps.

  Thank you.

• Qosmio X 300 - 16 d - thermal buffer/paste solution for processor and Nvidia MCP

  Can anyone suggest a good thermal solution (specific) for the Qosmio X 300 - 16 d CPU and the Nvidia MCP?

  I ask because there is a slight complication with the D 16 (a SLI configuration)... the heatsink for the CPU and the Nvidia MCP are connected in the same thermal module, but while the CPU heat sink is screwed, the chip Nvidia MCP is not - there is a large gap between the chip and the radiator.

  I'm guessing that a form any thermal pad should be used here instead of the grease/paste? Someone know what thermal pad was used by Toshiba for this, or point me to a high quality replacement that is suitable to be used?

  Thank you

  Chris

  Hello

  As far as I know the thermal grease 776 (part num: K000055600) could be used.
  But there are different cooling hang as mentioned by Akuma.

  There is a fan thermal 1 DUAL - VGA (K000061940) and thermal fan 2 dual VGA (K000061950) as well.
  I assume that both are for the SLI configuration.
  There are also a few other modules cooling VGA (VGA THERMAL MODULE-1-GT-NB9E K000065560 and K000065560 of TMA VGA THERMAL MODULE-2-NB9E-W/O)

  You can google for these numbers found in internet

• CQ60-212EA (buffer thermal or thermal shim copper)

  Hi, I have a Compaq CQ60-212EA, and I read the user guide, but in the page 4-43 are not written specifications of the heatfrom the GPU (NVIDIA chipset)pad .

  I need to replace the thermal pad ('LIGHT BLUE' - on my laptop) because it is very old, I want to update this laptop.

  The most important specification of the thermal or thermal buffer in copper shim's thickness.

  I sawdifferent thickness (0. 3 mm, 0. 5 mm, 0. 6 mm 0 8 mm 1 mm 1. 2 mm, 1. 5 mm 1. 8 mm 2 mm 2.) TR 5 mm 3 mm) and sizes (15x15mm, 20x20mm)

  Can you help me to know the right size/thickness of this thermal buffer?

  I was wondering if I could just use thermal paste Arctic Cooling MX-4 instead of buy new thermal pads or the thermal copper wedges?

  Thank you!

  I've successfully replaced my AMD Sempron if-40 for an AMD Turion, model: RM-72, which is a Dual core 2.1 Ghz cpu.

  I used the thermal paste Arctic Cooling MX-4 for the processor and a copper thermal shim (thickness: 1 mm; size: 15 x 15 mm) with the thermal compound for GPU chipset.

  Thank you

• Thermal compound HP G61

  Hello

  I have my laptop for several years now, but recently it has become very hot, and the fan continues blowing loudly. As the guarantee of the laptop disappeared for several years now, I decided to open the case to clean the fan and apply new thermal paste. However, when you remove the fan I noticed several black thermal pads on some of them, for what I guess is, GPU chipsets. The pads were very dusty and cracked. I cleaned the fan and am now trying to figure out what I can use as a substitute for black thermal pads. I guess than regular thermal compound from the CPU is sufficient for GPU chipsets.

  Heat sink code is:

  HP 534684-001 SPARE PART

  Do you have any idea what I can use?

  Kind regards

  Soden

  The black keys which you reffer are carpets made from Silicon heat transfer. I looked at your radiator, and the picture shows a copper box that is for the cpu. I would recommend artic silver or a similar compound high range. Silicon pads can be had online (example):

  http://stores.eBay.com/best-computerparts/soft-thermal-pads-/_i.html?_fsub=2445042013

  The color can mean either thickness or rate of heat transfer. This is the most difficult part that most retailers ebay do not list the rates of HT, but nothing in the 1.5 - 2.0W range will be just fine. The most important is the thickness. You don't want to make too thin as so it will not make good contact. Not thick or it will prevent other areas of the radiator to make good contact.

  I'm trying to find the best rate HT. If you have to you can stack the pads, as Silicon will give a little and it will not affect heat transfer. Beware of the shims. Not done properly, they can put undo stress on the Inserter and subclassing leading to failure to chip.

• HP Probook G1: thermal paste and buffers

  Hello, I write here because I couldn't find anything on the subject in the manual, at least he said thermal material which can mean thermal paste but also thermal pads. If I open the HP Probook 450 G1 to clean dust, change the thermal paste on the processor unit, do I need to buy for the thermal pad to the GPU, and if I need tampons and not only stick, how big exactly (how thin - 0,5 mm, 1 mm ar even 2mm)? Thanks in advance for your help. It's always nice to have a professional guide you a bit in these specific areas.

  On the CPU and under the radiator, anywhere that is metal on metal, you will install thermal paste. On video and, possibly, the main chip of I/O, you will usually have 'pads' thermal that are made a composed like rigid silly putty. On some models, there is even a thermal "pad" on the CPU. If you are careful with those you can simply reuse. Don't put thermal paste on them. When the manual talks about heat 'material', this means the pads. When you remove the heat sink, it will be obvious when it is metal on metal and where it's a towel. Metal to metal contact points must be cleaned and have composed again applied. Cushion points should just be kept intact and reinstalled.

  Personally, when I rebuild a laptop, I don't like these thermal pads and I remove the protections and use the material of copper shim and you will sometimes need to use more than a wedge to make the heat sink have just the right connection. It must make good contact, but not to distort the heatsink. But if you use the copper shims you will need to use a thermal paste (for example, Arctic Silver) on the points above and below the shims. Cooling performance is much better with shims.

  If it's 'the Answer' please click on 'Accept as Solution' to help others find it.

• laptop most of HP's thermal shutdown?

  the operating system is Windows 7 Ultimate, but when I turn on it was thermal shutdown and suitor was overheated and I wait for 2 hours but still present (I think that stop at random) and I'll take on the laptop with no battery. What should I do?

  Hi Obito,

  I understand that your computer shuts down because of overheating.

  Usually, overheating occurs due to hardware problem.

  I suggest you to check with the following steps to try to solve the problems of overheating:

  (a) clean the mouths of aeration and check if the fan is working or not.
  (b) to use certain software, then check if your system fan running at good speed.
  (c) do not use your laptop on a surface that block the air intakes.
  (d) thermal pads may be burned. Try replacing them with a new.
  (e) there could be a fault with the equipment. You can get it checked with professional experts.
  (f) to adjust the parameters of power supply to your needs. Low power consumption means lower heat production.
  (g) do not allow cell phone operation with closed lid. It always generates the heat inside the laptop. You can close the lid only if the laptop automatically goes to sleep or Hibernate mode.
  (h) also, try installing the latest drivers and software on the Web site of the manufacturer.

  If the problem persists, I suggest you please contact HP support for help.

  http://WWW8.HP.com/us/en/support.html

  Reference:

  The thermal shutdown that scares me!

  http://h30434.www3.HP.com/T5/notebook-operating-systems-e-g-Windows-8-and-software/thermal-shutdown-is-making-me-worried/TD-p/951381

  Please report if you encounter any problems related to Windows and we will be happy to help you.